Journal paper 게재(Proceedings of the IEEE) : Flexible Multimodal Sensors for Electronic Skin: Principle, Materials, Device, Array Architecture, and Data Acquisition Method

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Flexible Multimodal Sensors for Electronic Skin: Principle, Materials, Device, Array Architecture, and Data Acquisition Method

Sanghun Jeon, Soo-Chul Lim, Tran Quang Trung, Minhyun Jung, and Nae-Eung Lee

Abstract:

Electronic skin (e-skin) is designed to mimic the comprehensive nature of human skin. Various advances in e-skin continue to drive the development of the multimodal tactile sensor technology on flexible and stretchable platforms. e-skin incorporates pressure, temperature, texture, photographic imaging, and other sensors as well as data acquisition and signal processing units formed on a soft substrate for humanoid robots, wearable devices, and health monitoring electronics that are the most critical applications of soft electronics. This artificial skin has developed very rapidly toward becoming real technology. However, the complex nature of e-skin technology presents significant challenges in terms of materials, devices, sophisticated integration methods, and interference-free data acquisition. These challenges range from functional materials, device architecture, pixel design, array structure, and data acquisition method to multimodal sensing performance with negligible interference. In this article, we present recent research trends and approaches in the field of flexible and stretchable multimodal sensors for e-skin focusing on the following aspects: 1) flexible and stretchable platforms; 2) operating principles and materials suitable for pressure, temperature, strain, photograph, and hairy sensor devices; 3) device and integration architectures, including multimodal single cells, three-axis tactile sensors, vertical-stacked sensor arrays, active matrix sensor arrays, and integration electronics; 4) reliable acquisition methods for various texture sensing and machine-learning algorithms for processing tactile sensing data; and 5) future outlook.
Published in: Proceedings of the IEEE ( Early Access )
Page(s): 1 – 19